U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Plasma treatment apparatus

Patent 4767641 Issued on August 30, 1988. Estimated Expiration Date: Icon_subject July 3, 2006. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

Plasma reactor apparatus
Patent #: 4209357
Issued on: 06/24/1980
Inventor: Gorin ,   et al.

Sputter-etching device
Patent #: 4351714
Issued on: 09/28/1982
Inventor: Kuriyama

Etching plasma generator diffusor and cap
Patent #: 4612432
Issued on: 09/16/1986
Inventor: Sharp-Geisler

Amorphous silicon film forming apparatus
Patent #: 4633809
Issued on: 01/06/1987
Inventor: Hirose ,   et al.

Hollow cathode enhanced plasma for high rate reactive ion etching and deposition Patent #: 4637853
Issued on: 01/20/1987
Inventor: Bumble ,   et al.

Inventors

Assignee

Application

No. 06/881706 filed on 07/03/1986

US Classes:

427/569, Plasma (e.g., corona, glow discharge, cold plasma, etc.)118/50.1, With means to apply electrical and/or radiant energy to work and/or coating material118/715, GAS OR VAPOR DEPOSITION118/723E, Having glow discharge electrodes (e.g., DC, AC, RF, etc.)118/729, Moving work support156/345.43, Having glow discharge electrode gas energizing means204/298.31, Etching204/298.33, Specified gas feed or withdrawal204/298.35, Multi-chamber, load/unload means or moving workpiece216/71, Specific configuration of electrodes to generate the plasma315/111.21, Plasma generating427/580Electrical discharge (e.g., arcs, sparks, etc.)

Examiners

Primary: Lacey, David L.

Attorney, Agent or Firm

International Classes

B29C 59/14 (20060101)
B29C 59/00 (20060101)
H01J 37/32 (20060101)

Foreign Application Priority Data

1986-03-04 DE

Abstract

Device for the plasma treatment of substrates (7) in a high frequency-excited plasma discharge between two electrodes (3, 8), supplied by a high-frequency source (6). The first electrode is constructed as a hollow anode (3) and the second electrode (8), which carries the substrate (7), is deposited in front of the hollow space (10) of the hollow anode or can be passed by this. Moreover, the hollow anode (3) has an edge (9), which is drawn out in the direction of the second electrode (8) and which, relative to the second electrode, forms a gap s1 all around that does not exceed 10 mm in width. In order to form the electrode so that the gap width is not a critical feature, projections (12) are disposed in the hollow space (10) of the hollow anode (3), said projections increasing the internal surface area (11) of the hollow anode (3). Preferably, these projections (12) are constructed as rib structures, which may also assume a honeycomb form.

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