Endoscope using a chip carrier type solid state imaging device
Patent 4745470 Issued on May 17, 1988. Estimated Expiration Date: 
April 3, 2007. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
April 3, 2007. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesImage sensor assembly Endoscope with signal transmission system and method of operating same Connector module for video endoscopic system Endoscope Patent #: 4573450 InventorsAssigneeApplicationNo. 07/033954 filed on 04/03/1987US Classes:348/76, Physical structure of circuit element600/109, With camera or solid state imager600/130With particular arrangement of internal elements (e.g., shaft reducing)ExaminersPrimary: Britton, Howard W.Assistant: Kostak, Victor R. Attorney, Agent or FirmInternational ClassesH04N 5/232 (20060101)H04N 5/225 (20060101) A61B 1/05 (20060101) Foreign Application Priority Data1986-04-04 JPAbstractA solid state imaging device and a substrate to which this solid state imaging device is fitted is contained in the tip part of an endoscope. Conductive parts are formed on at least one side surface of the substrate. The positions of the conductive parts, when that the conductive parts are overlapped with the solid state imaging device, are retreated to be within the electrode positions of the solid state imaging device so that the imaging device may be contained in a small space. | |
