U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Electrically conductive adhesive sheet, circuit board and electrical connection structure using the same

Patent 4735847 Issued on April 5, 1988. Estimated Expiration Date: Icon_subject June 22, 2007. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

3740366

3762946

3778306

Pressure-sensitive electric conductive sheet material
Patent #: 4258100
Issued on: 03/24/1981
Inventor: Fujitani ,   et al.

Flexible tape having stripes of electrically conductive particles for making multiple connections
Patent #: 4546037
Issued on: 10/08/1985
Inventor: King

Flexible tape having bridges of electrically conductive particles extending across its pressure-sensitive adhesive layer
Patent #: 4548862
Issued on: 10/22/1985
Inventor: Hartman

Heat sensitive type adhesive connector Patent #: 4680226
Issued on: 07/14/1987
Inventor: Takeda

Inventors

Assignee

Application

No. 07/061608 filed on 06/22/1987

US Classes:

428/209, Including metal layer428/328, Heavy metal or aluminum or compound thereof428/356, Including metal or compound thereof or natural rubber428/901PRINTED CIRCUIT

Examiners

Primary: Swisher, Nancy A. B.

Attorney, Agent or Firm

International Classes

H01R 4/00 (20060101)
H01R 4/04 (20060101)
H05K 3/32 (20060101)
H05K 3/36 (20060101)
H05K 1/18 (20060101)

Foreign Application Priority Data

1983-12-27 JP

Abstract

An electrically conductive adhesive sheet is disclosed which has an electrically conducting property across a thickness thereof and an electrically insulating property along a sheet surface direction. The electrically conductive adhesive sheet comprises an electrically insulating adhesive material and electrically conductive metal powder uniformly dispersed therein. The metal powder has a melting point lower than a certain working temperature, and is flattened by application of pressure between a pair of conductors between which the adhesive sheet is provided. The adhesive material is molten at the certain working temperature and is flown by application of pressure. The adhesive sheet is useful to electrically connect a pair of circuit boards each having a plurality of conductor patterns thereon by bonding corresponding ones through the metal powder as molten, while keeping the neighboring patterns insulated. The circuit board is mechanically integrated simultaneously by the adhesive sheet. The circuit board and the connection structure using such an adhesive sheet as above are also disclosed.

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