Process for manufacturing capacitive devices and capacitive devices manufactured by the process
Patent 4733328 Issued on March 22, 1988. Estimated Expiration Date: 
December 18, 2006. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
December 18, 2006. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3267342 3273033 3483447 3619744 3784887 3878443 3902102 Thin film capacitors and method of making the same Patent #: 4631633 InventorApplicationNo. 06/943526 filed on 12/18/1986US Classes:361/320, Ceramic and glass29/25.42Solid dielectric typeExaminersPrimary: Griffin, Ronald W.Attorney, Agent or FirmInternational ClassH01G 4/06 (20060101)AbstractThis invention relates to a laminated capacitive element for use in electrical devices such as filtered connectors, said element comprising a laminated body of a metal substrate having one or more layered structures heat bonded to all or a portion of the surfaces thereof, said structures comprising a non-conductive layer composed of a sintered finely divided non-conductive material heat bonded to said metal substrate and a metal conductive layer composed of sintered finely divided metal heat bonded to said sintered non-conductive material. | |
