Patent References 3515850 3609294 3852563 Integrated heater element array and fabrication method Thermal printing head Thermal head Method for manufacturing an integrated circuit device Thermal ink jet printhead with self-passivating elements Liquid jet recording head Patent #: 4567493 InventorApplicationNo. 06/820754 filed on 01/17/1986US Classes:347/59, Integrated29/592.1, Electrical device making347/50, Electrical connector means427/402, APPLYING SUPERPOSED DIVERSE COATING OR COATING A COATED BASE427/404, Metal coating427/97.4, With posttreatment of coating or coating material438/21, MANUFACTURE OF ELECTRICAL DEVICE CONTROLLED PRINTHEAD438/238, Including passive device (e.g., resistor, capacitor, etc.)438/384, Deposited thin film resistor438/632Utilizing reflowExaminersPrimary: Goldberg, E. A.Assistant: Preston, Gerald E. Attorney, Agent or FirmInternational ClassB41J 2/16 (20060101)AbstractThis application discloses a novel thermal ink jet printhead and related integrated pulse driver circuit useful in thermal ink jet printers. This combined printhead and pulse drive integrated circuit includes a first level of metalization comprising a refractory metal which is patterned to define the lateral dimension of the printhead resistor. A passivation layer or layers are deposited atop this first level of metalization and patterned to have an opening or openings therein for receiving a second level of metalization. This second level of metalization such as aluminum may then be used for electrically interconnecting the printhead resistors to MOSFET drivers and the like which have been fabricated in the same silicon substrate which provides support for the printhead resistors. Thus, this "on-chip" driver construction enables these pulse driver transistors to be moved from external electronic circuitry to the printhead substrate. | |