U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Integrated thermal ink jet printhead and method of manufacture

Patent 4719477 Issued on January 12, 1988. Estimated Expiration Date: Icon_subject January 17, 2006. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

3515850

3609294

3852563

Integrated heater element array and fabrication method
Patent #: 3953264
Issued on: 04/27/1976
Inventor: Wu

Thermal printing head
Patent #: 4168343
Issued on: 09/18/1979
Inventor: Arai ,   et al.

Thermal head
Patent #: 4232213
Issued on: 11/04/1980
Inventor: Taguchi ,   et al.

Method for manufacturing an integrated circuit device
Patent #: 4472875
Issued on: 09/25/1984
Inventor: Christian ,   et al.

Thermal ink jet printhead with self-passivating elements
Patent #: 4535343
Issued on: 08/13/1985
Inventor: Wright ,   et al.

Liquid jet recording head Patent #: 4567493
Issued on: 01/28/1986
Inventor: Ikeda ,   et al.

Inventor

Application

No. 06/820754 filed on 01/17/1986

US Classes:

347/59, Integrated29/592.1, Electrical device making347/50, Electrical connector means427/402, APPLYING SUPERPOSED DIVERSE COATING OR COATING A COATED BASE427/404, Metal coating427/97.4, With posttreatment of coating or coating material438/21, MANUFACTURE OF ELECTRICAL DEVICE CONTROLLED PRINTHEAD438/238, Including passive device (e.g., resistor, capacitor, etc.)438/384, Deposited thin film resistor438/632Utilizing reflow

Examiners

Primary: Goldberg, E. A.
Assistant: Preston, Gerald E.

Attorney, Agent or Firm

International Class

B41J 2/16 (20060101)

Abstract

This application discloses a novel thermal ink jet printhead and related integrated pulse driver circuit useful in thermal ink jet printers. This combined printhead and pulse drive integrated circuit includes a first level of metalization comprising a refractory metal which is patterned to define the lateral dimension of the printhead resistor. A passivation layer or layers are deposited atop this first level of metalization and patterned to have an opening or openings therein for receiving a second level of metalization. This second level of metalization such as aluminum may then be used for electrically interconnecting the printhead resistors to MOSFET drivers and the like which have been fabricated in the same silicon substrate which provides support for the printhead resistors. Thus, this "on-chip" driver construction enables these pulse driver transistors to be moved from external electronic circuitry to the printhead substrate.

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