Molded lead frame dual in line package including a hybrid circuit
Packaging process for semiconductors
Low-cost semiconductor device package and process Patent #: 4535350
ApplicationNo. 06/810032 filed on 12/17/1985
US Classes:29/827, Beam lead frame or beam lead device174/529, On lead frame174/536, Lead frame174/551, Leads174/564, Seal257/667, With dam or vent for encapsulant257/E21.499, Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (EPO)257/E21.504, Moulds (EPO)257/E23.189, Leads being parallel to base (EPO)264/248, Fusion bonding of preformed bodies and shaping at joint only264/259, Shaping material and uniting to a preform264/272.17, Semiconductor or barrier layer device (e.g., integrated circuit, transistor, etc.)264/274, Preform particularly provided with means to provide interlock with shaped material438/124And encapsulating
ExaminersPrimary: Grimley, Arthur T.
Assistant: Ton, David
Attorney, Agent or Firm
International ClassesH01L 21/02 (20060101)
H01L 21/50 (20060101)
H01L 23/02 (20060101)
H01L 23/057 (20060101)
H01L 21/56 (20060101)
AbstractA method of making an integrated circuit package comprising an integrated "chip" within an hermetically sealed housing with external electrical leads extending from the chip terminals, and the product formed by such method. The method involves injection molding of a thermoplastic rim on and in sealed relation to a lead frame prior to locating the chip in the central region of the frame and installing fine wire connections from the chip terminals to the lead fingers. The housing is completed by a solid bottom wall insert sealed in the lower mouth of the rim and a solid top wall cap sealed to the upper mouth of the rim by procedures which involve no flowing of plastic material over or into contact with either (i) the upper surfaces of the lead fingers prior to making the wire connections to such fingers, or (ii) the chip and the wire connectors after they have been associated with the lead frame.