Solder composition
Patent 4695428 Issued on September 22, 1987. Estimated Expiration Date: 
August 21, 2006. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
August 21, 2006. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 1437641 1869378 InventorsAssigneeApplicationNo. 06/898498 filed on 08/21/1986US Classes:420/561, Antimony, or bismuth containing420/560Copper containingExaminersPrimary: Rutledge, L. DewayneAssistant: McDowell, Robert L. Attorney, Agent or FirmInternational ClassB23K 35/26 (20060101)AbstractA low temperature, lead-free, cadmium-free solder for joining metals, primarily copper tube or brass pipe and fittings. The solder composition, being free of lead and other known toxic metals, has a composition range of 0.5-4.0% antimony, 0.5-4.0% zinc, 0.1-3.0% silver, 0.1-2.0% copper and 86.8-98.8% tin, is especially adaptable for plumbing applications where solder joints are exposed to potable water. | |
