Mounting arrangement for an integrated circuit unit in an electronic digital watch
Multilayer flexible printed circuit tape
Cover layer for flexible circuits
Thin flexible electronic calculator
ApplicationNo. 06/822935 filed on 01/27/1986
US Classes:361/751, With particular conductive material or coating235/488, Laminated235/492, Conductive257/E23.177, Flexible insulating substrates (EPO)361/757, With particular material361/764, Integrated circuit361/792Plural contiguous boards
ExaminersPrimary: Kucia, R. R.
Attorney, Agent or Firm
International ClassesH01L 23/538 (20060101)
H01L 23/52 (20060101)
AbstractA flexible printed circuit board assembly having an integrated circuit die bonded directly thereto. A first layer of the flexible printed circuit board assembly includes a plurality of conductive paths and geometrical patterns on each of its surfaces. The conductive patterns include pads for mounting the integrated circuit die and connecting the wires from the integrated circuit. Additional intermediate layers of the flexible printed circuit board assembly, having an aggregate thickness greater than the height of the integrated circuit die and associated leads bonded thereto, surround the integrated circuit die. The top layer of the flexible printed circuit board provides for total encapsulation of the integrated circuit die for protection thereof. In the preferred embodiment that portion of the top layer which covers the integrated circuit die is opaque to prevent the passage of ultraviolet light which might otherwise cause damage to the integrated circuit.