Parallel-flow air system for cooling electronic equipment
Patent 4674004 Issued on June 16, 1987. Estimated Expiration Date: 
July 3, 2006. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
July 3, 2006. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 2843806 3198991 3817160 Apparatus for the heat treatment of textiles Electronic circuit module cooling Slotted heat sinks for high powered air cooled modules Air jet powered cooling system for electronic assemblies Apparatus for cooling integrated circuit chips Circuit board installation Patent #: 4498118 InventorsAssigneeApplicationNo. 06/881725 filed on 07/03/1986US Classes:361/694, With air circulating means165/908, FLUID JETS361/693CircularExaminersPrimary: Tapolcai, William E.Attorney, Agent or FirmInternational ClassH05K 7/20 (20060101)AbstractThe present disclosure describes an air cooling system which has the ability to maintain acceptable temperature levels in present day high density electronic equipment. More specifically, the system provides an arrangement whereby each printed circuit card has its own ducting structure affixed thereto to form an integral unit. Cooling air streams are directed simultaneously from individual apertures in the ducting structure upon a respective plurality of integrated circuit package assemblies mounted on the card.Other References
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