Surface acoustic wave devices and method of manufacture thereof
Patent 4672254 Issued on June 9, 1987. Estimated Expiration Date: 
October 11, 2005. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
October 11, 2005. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesFrequency trimming of surface acoustic wave devices Method and apparatus for depositing a material on a surface Frequency trimming of saw resonators Patent #: 4442574 InventorsApplicationNo. 06/786585 filed on 10/11/1985US Classes:310/313R, Surface acoustic wave devices216/17, Forming or treating of groove or through hole216/58, GAS PHASE ETCHING OF SUBSTRATE219/121.69, Methods219/121.85, Method29/25.35, PIEZOELECTRIC DEVICE MAKING310/313D, Grating or reflector in wave path310/318, Input circuit for electrical output from piezoelectric element333/193, Using surface acoustic waves367/157, Piezoelectric427/586Pyrolytic use of laser or focused light (e.g., IR, UV lasers to heat, etc.)ExaminersPrimary: Powell, William A.Attorney, Agent or FirmInternational ClassesH03H 9/02 (20060101)H03H 3/08 (20060101) H03H 3/00 (20060101) AbstractA phase and amplitude compensated surface acoustic wave (SAW) structure is described in which computer controlled compensation is achieved by laser chemical etching of selective portions of a compound chemical film deposited on the surface of a piezoelectric SAW substrate in the path of propagation. The compound film comprises a layer of amplitude attenuating cermet material formed on the substrate and a phase compensating layer of molybdenum formed over the cermet material and in contact with the substrate surface.Other References
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