Solder composition
Patent 4670217 Issued on June 2, 1987. Estimated Expiration Date: 
July 26, 2005. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
July 26, 2005. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesInventorsAssigneeApplicationNo. 06/759596 filed on 07/26/1985US Classes:420/562Antimony, or bismuth containingExaminersPrimary: Rutledge, L. DewayneAssistant: McDowell, Robert L. Attorney, Agent or FirmInternational ClassB23K 35/26 (20060101)AbstractA low temperature, lead-free, cadmium-free solder for joining metals, primarily copper tube or brass pipe and fittings. The solder composition, being free of lead and other known toxic metals, has a composition range of 0.5-4.0% antimony, 0.5-4.0% zinc, 0.5-2.0% silver and 90.0-98.5% tin, is especially adaptable for plumbing applications where solder joints are exposed to potable water.Field of SearchAntimony, or bismuth containing | |
