Process for the production of metal patterns on insulating substrates as well as insulating substrates with metal patterns, especially printed circuits
Patent 4666739 Issued on May 19, 1987. Estimated Expiration Date: 
May 6, 2005. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
May 6, 2005. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesPretreatment of plastic materials for metal plating Method for producing printed circuits Process for metal-coating plastic surfaces Method of making a printed circuit board Metal plating on plastics Patent #: 4520046 InventorAssigneeApplicationNo. 06/731163 filed on 05/06/1985US Classes:205/126, Electroless coating from bath containing metal ions and reducing agent prior to electrolytic coating427/305, Nickel, copper, cobalt, or chromium coating427/306, Organic base427/307, Etching, swelling, or dissolving out part of the base427/97.2, Coating hole wall427/98.1, Activating or catalyst pretreatment430/315Material deposition onlyExaminersPrimary: Smith, John D.Attorney, Agent or FirmInternational ClassesH05K 3/38 (20060101)H05K 3/42 (20060101) Foreign Application Priority Data1984-05-11 DEAbstractA process is described for the production of metal patterns on insulating substrates, especially of printed circuits, in which the substrates are provided with holes by means of electrical connections and the metal patterns are produced on the surface of the substrate with the aid of a negative mask in accordance with the subtractive process, said process being characterized by the following steps:treatment in gaseous sulfur trioxide;application of a negative mask which corresponds to the conductive pattern to be produced;through-hole-plating and subsequent plating of the conductive pattern, which is effected by the following steps in the process:activation by means of an ionogenic precious metal solution, treatment in a reducing agent solution, chemical or chemical and electrolytic deposit, in which the metal deposit takes place solely on the surface of the metal pattern which is to be produced.In addition, insulating substrates with metal patterns, especially printed circuits, are disclosed. |
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