Pretreatment of plastic materials for metal plating
Method for producing printed circuits
Process for metal-coating plastic surfaces
Method of making a printed circuit board
Metal plating on plastics Patent #: 4520046
ApplicationNo. 06/731163 filed on 05/06/1985
US Classes:205/126, Electroless coating from bath containing metal ions and reducing agent prior to electrolytic coating427/305, Nickel, copper, cobalt, or chromium coating427/306, Organic base427/307, Etching, swelling, or dissolving out part of the base427/97.2, Coating hole wall427/98.1, Activating or catalyst pretreatment430/315Material deposition only
ExaminersPrimary: Smith, John D.
Attorney, Agent or Firm
International ClassesH05K 3/38 (20060101)
H05K 3/42 (20060101)
Foreign Application Priority Data1984-05-11 DE
AbstractA process is described for the production of metal patterns on insulating substrates, especially of printed circuits, in which the substrates are provided with holes by means of electrical connections and the metal patterns are produced on the surface of the substrate with the aid of a negative mask in accordance with the subtractive process, said process being characterized by the following steps:treatment in gaseous sulfur trioxide;application of a negative mask which corresponds to the conductive pattern to be produced;through-hole-plating and subsequent plating of the conductive pattern, which is effected by the following steps in the process:activation by means of an ionogenic precious metal solution, treatment in a reducing agent solution, chemical or chemical and electrolytic deposit, in which the metal deposit takes place solely on the surface of the metal pattern which is to be produced.In addition, insulating substrates with metal patterns, especially printed circuits, are disclosed.