U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Low headroom ventilating apparatus for cooling an electrical enclosure

Patent 4665466 Issued on May 12, 1987. Estimated Expiration Date: Icon_subject November 26, 2005. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

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Inventor

Assignee

Application

No. 06/802041 filed on 11/26/1985

US Classes:

361/696, With heat exchanger unit174/16.1, By ventilation or gas circulation361/700, Change of physical state361/701With heat exchanger unit

Examiners

Primary: Joyce, Harold

Attorney, Agent or Firm

International Class

H05K 7/20 (20060101)

Abstract

Apparatus for cooling an electrical enclosure for use where headroom is limited. An imperforate top wall and a perforate ceiling wall below it define an exhaust compartment. The ceiling wall has openings above natural hot spots on heat-producing electrical components in the enclosure to receive heated air rising by convection. In one embodiment, louvered intake openings and internal baffles direct cool, external air to the bottom of the head-producing components. A fan draws heated air from the exhaust compartment and discharges it through a louvered orifice outside the enclosure, thereby augmenting the natural upflow of heated air by convection and preventing accumulation of heated air. In another embodiment, especially suited to dusty or corrosive environments, the electrical components are completely sealed, and clean inside cooling air is continuously recycled in a closed circuit between the heat-producing components and refrigerant-cooled heat-exchange apparatus. In both embodiments, the air-circulating fans and associated ductwork are supported in the housing independently of the top cover wall enabling the latter to be removed without disturbing a fan or power connection to it.

Other References

  • Chu et al., "Air Cooling Scheme", IBM Technical Disclosure Bulletin, vol. 16, No. 1, Jun. 1973, pp. 296 and 297
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