Segmented lead frame strip for IC chip carrier
Patent 4663651 Issued on May 5, 1987. Estimated Expiration Date: 
September 22, 2006. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
September 22, 2006. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesConditioning supports of micro-plates of integrated circuits Carrier tapes for semiconductor devices Stacked interdigitated lead frame assembly Patent #: 4496965 InventorsAssigneeApplicationNo. 06/910358 filed on 09/22/1986US Classes:257/666, LEAD FRAME174/536, Lead frame174/541, Connection174/551, Leads257/E23.042Plurality of lead frames mounted in one device (EPO)ExaminersPrimary: James, Andrew J.Assistant: Clark, S. V. Attorney, Agent or FirmInternational ClassesH01L 23/48 (20060101)H01L 23/495 (20060101) AbstractA lead frame for use with an integrated circuit chip comprises a plurality of lead frame segments, each segment comprising a plurality of leads the inner ends of which converge towards a pad area for the chip encircled by the segments. | |
