Conditioning supports of micro-plates of integrated circuits
Carrier tapes for semiconductor devices
Stacked interdigitated lead frame assembly Patent #: 4496965
ApplicationNo. 06/910358 filed on 09/22/1986
US Classes:257/666, LEAD FRAME174/536, Lead frame174/541, Connection174/551, Leads257/E23.042Plurality of lead frames mounted in one device (EPO)
ExaminersPrimary: James, Andrew J.
Assistant: Clark, S. V.
Attorney, Agent or Firm
International ClassesH01L 23/48 (20060101)
H01L 23/495 (20060101)
AbstractA lead frame for use with an integrated circuit chip comprises a plurality of lead frame segments, each segment comprising a plurality of leads the inner ends of which converge towards a pad area for the chip encircled by the segments.