System for measuring and detecting printed circuit wiring defects
Patent 4650333 Issued on March 17, 1987. Estimated Expiration Date: 
April 12, 2004. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
April 12, 2004. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3669540 3699304 3712466 3713739 3834819 3844799 Surface profile measuring device and method Method of and video system for identifying different light-reflective surface areas on articles Electroless copper plating process with dissolved oxygen maintained in bath Laser measuring system for inspection InventorsApplicationNo. 06/599422 filed on 04/12/1984US Classes:356/606, Line of light projected348/126, Of electronic circuit chip or board356/237.5, On patterned or topographical surface (e.g., wafer, mask, circuit board)356/631By triangulationExaminersPrimary: Evans, F. L.Assistant: Harringa, Joel L. Attorney, Agent or FirmInternational ClassesG01B 11/25 (20060101)G01B 11/24 (20060101) G01N 21/956 (20060101) G01N 21/88 (20060101) G01R 31/309 (20060101) G01R 31/28 (20060101) AbstractA non-contact system for detecting printed circuit wiring defects and for measuring circuit feature height relative to a substrate. The system has an energy source for illuminating the substrate and circuit features and a scanner for both instantaneously receiving energy reflected from the substrate and circuit features and for generating a signal in response to the reflected energy, which signal is adapted to vary with the intensity of the reflected energy. An analyzer is connected to the scanner for correlating the generated signal to a measurement representative of the height of the circuit features relative to the substrate. Variations and non-uniformity of the substrate surface due to bending, warpage or other causes can be accounted for so as to provide an accurate measurement of the height of a circuit feature relative to the substrate surface on which it is mounted.Other References
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