Method of electrically interconnecting a laminated printed circuit by use of a compressed, solder-plated connector pin
Patent 4644643 Issued on February 24, 1987. Estimated Expiration Date: 
July 29, 2005. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
July 29, 2005. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3264524 3281923 InventorAssigneeApplicationNo. 06/760229 filed on 07/29/1985US Classes:29/845, With shaping or forcing terminal into base aperture156/273.9, Work constitutes conductor of electrical circuit156/92, With penetrating of fastener29/830, Assembling bases29/843, By metal fusion bonding361/792Plural contiguous boardsExaminersPrimary: Goldberg, Howard N.Assistant: Echols, P. W. Attorney, Agent or FirmInternational ClassesH02K 29/06 (20060101)H02K 29/08 (20060101) AbstractA method for electrically interconnecting a laminated printed circuit structure comprises the steps of inserting a solder-plated connecting conductor pin into a through hole bored through overlying interconnecting sections of the respective printed circuit sheets, applying pressure to both ends of the pin to compress and thicken the pin, and passing an electric current through the pin to solder the pin and the respective interconnecting sections to one another at the inner peripheral surface of the through hole.Other References
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