Patent References 3700420 Plated foil for liquid interface bonding of titanium 4350743 Layered active brazing material and method for producing it Patent #: 4448853 InventorAssigneeApplicationNo. 06/618784 filed on 06/08/1984US Classes:428/432, Next to metal or compound thereof428/433, Alloy or free metal428/434, Noble metal containing428/469, Next to metal salt or oxide428/660, Refractory (Group IVB, VB, or VIB) metal-base component428/668, Group VIII or IB metal-base component428/671, Cu-base component alternative to Ag-, Au-, or Ni-base component428/673, Ag-base component428/674Cu-base componentExaminersPrimary: Lieberman, Allan M.Attorney, Agent or FirmInternational ClassesB23K 35/00 (20060101)B23K 35/30 (20060101) C04B 37/02 (20060101) C04B 37/00 (20060101) C04B 37/04 (20060101) Foreign Application Priority Data1983-06-17 JPAbstractA clad brazing filler for use in bonding a ceramic to a metal, glass or another ceramic having a substantially different thermal expansion coefficient, and composites using such a filler. According to one aspect of the invention, a brazing filler of a clad type is provided which is composed of a titanium layer adjacent a silver, copper or silver-copper alloy layer, or a combination of silver and copper layers, with the titanium content being in a range of 3 to 80% of the total weight of the layers of the assembly. In accordance with another aspect of the invention, a brazing filler of the clad type is provided which combines the layer arrangement of the first aspect with either a layer of a metal having a low thermal expansion coefficient, a layer of a metal having a low Young's modulus, for a combination layer of both, arranged in any order.Field of SearchNext to metal or compound thereofAlloy or free metal Noble metal containing ALL METAL OR WITH ADJACENT METALS Refractory (Group IVB, VB, or VIB) metal-base component Cu-base component alternative to Ag-, Au-, or Ni-base component Ag-base component Cu-base component PRINTED CIRCUIT Next to metal salt or oxide | |