Self-aligning package for integrated circuits
Method of connecting surface mounted packages to a circuit board and the resulting connector
Universal interconnection substrate
Method of mounting semiconductor chip for producing semiconductor device and a chip-supporting member used therein
Universal leadless chip carrier mounting pad
Chip-carrier substrates Patent #: 4509096
ApplicationNo. 06/614661 filed on 05/29/1984
US Classes:361/768, Having leadless component174/535, Details of mount174/557, Lands361/783Having semiconductive device
ExaminersPrimary: Grimley, Arthur T.
Assistant: Tone, D. A.
Attorney, Agent or Firm
International ClassesH05K 3/34 (20060101)
H05K 1/11 (20060101)
AbstractA pad configuration for surface mounted components having contact pads along the periphery thereof includes a plurality of interior pads distributed in a grid with the period of interior pads being three quarters of the period of the peripheral pads multiplied by an integer greater than 1.