Immersion cooled high density electronic assembly
Patent 4590538 Issued on May 20, 1986. Estimated Expiration Date: 
May 20, 2003. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
May 20, 2003. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesInventorAssigneeApplicationNo. 06/442569 filed on 11/18/1982US Classes:361/700, Change of physical state361/701With heat exchanger unitExaminersPrimary: Thompson, Gregory D.Attorney, Agent or FirmInternational ClassH05K 7/20 (20060101)AbstractAn immersion cooling system for high density electronic assemblies such as computers includes a container holding an inert cooling liquid, and stacks of circuit modules arranged in a generally radial pattern within the container. Coolant supply columns and coolant removal columns alternate between adjacent stacks around the pattern. The coolant supply columns include distribution manifolds which distribute incoming coolant at all levels to provide a flow of coolant to all circuit modules. The flow passes between adjacent boards of the modules and preferably along flow channels formed by the circuit chips aligned in rows. After passing across the circuit modules the heated coolant rises in coolant removal columns and flows over standpipes for removal from the container, and a pump and heat exchanger recools and recirculates the coolant. Pump up and pump down systems are also provided for withdrawing the coolant to a reservoir for servicing the circuitry.Other References
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