U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Solid state multiprobe testing apparatus

Patent 4585991 Issued on April 29, 1986. Estimated Expiration Date: Icon_subject March 13, 2005. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

3436605

3453545

3581151

3781596

Programmable interface contactor structure
Patent #: 3963986
Issued on: 06/15/1976
Inventor: Morton ,   et al.

Integrated circuit chip test and assembly package Patent #: 3984620
Issued on: 10/05/1976
Inventor: Robillard ,   et al.

Inventors

Assignee

Application

No. 06/710959 filed on 03/13/1985

US Classes:

324/757, Probe contact enhancement216/2, ETCHING OF SEMICONDUCTOR MATERIAL TO PRODUCE AN ARTICLE HAVING A NONELECTRICAL FUNCTION438/613Bump electrode

Examiners

Primary: Levy, Stuart S.
Assistant: Baker, Stephen M.

Attorney, Agent or Firm

International Classes

G01R 1/073 (20060101)
G01R 31/28 (20060101)

Abstract

A high density multiprobe including a multiprobe on a semiconductor substrate with contact pads selectively positioned in relation to the contacts of a device to be tested. Each of the selectively positioned contacts on the multiprobe semiconductor substrate include an elevated conductive surface that makes physical and electrical contact with the contacts of the device to be tested. In addition, the elevated conductive surfaces on the multiprobe are conductively connected to interface terminals on the semiconductor substrate to allow test signals to be input and output from the multiprobe device during testing. The multiprobe semiconductor substrate is also capable of containing onboard circuitry including buffers and logic circuitry for processing the test signals to be sent to and received from the device under test. A multiprobe testing device is also disclosed that includes the multiprobe semiconductor substrate with elevated contacts to allow for the testing of a semiconductor device.

Other References

  • W Anacker, "Low Inductance Testor Probe for Low Temperature Application", IBM Tech. Disc. vol. 22, No. 6, Nov. 1979, p. 2518
  • L. A. Gladstein et al., "Low Force Microcircuit Probe", IBM Tech. Disc. vol. 22, No. 7, Dec. 1979, pp. 2824-2826
  • J. Schick, "Electrical Contact Through an SiO2 Overlay by Ultrasonic Probe", IBM Tech. Disc. vol. 17, No. 11, Apr. 1975, pp. 3288-3289
  • H. P. Byrnes et al., "Pad Deformation Contactor", in IBM Tech Disc. Bulletin vol. 21, No. 11, Apr. 1979, pp. 4511-4512
  • R. A. Jaruela et al., "Stacked High-Density Multichip Module", in IBM Tech. Disc. Bulletin vol. 14, No. 10, Mar. 1972, pp. 2896-2897
  • Anacker, W., et al., "Fabrication of Multiprobe Miniature Electrical Connector", IBM Technical Disclosure Bull., vol. 19, No., Jun. 1976, pp. 372-374
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