In-mold process for fabrication of molded plastic printed circuit boards
Patent 4584767 Issued on April 29, 1986. Estimated Expiration Date: 
July 16, 2004. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
July 16, 2004. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 2772501 2861911 2971249 2972003 2986804 3077658 3161945 3499220 3889363 Method of making flexible printed circuits Patent #: 4411982 InventorApplicationNo. 06/631209 filed on 07/16/1984US Classes:29/848, With molding of insulated base174/255, With particular substrate or support structure174/257, Conducting (e.g., ink)174/258, Insulating174/261, With particular conductive connection (e.g., crossover)29/846Manufacturing circuit on or in baseExaminersPrimary: Goldberg, Howard N.Assistant: Arbes, Carl J. Attorney, Agent or FirmInternational ClassesB29C 45/14 (20060101)H05K 3/00 (20060101) H05K 1/00 (20060101) H05K 3/06 (20060101) AbstractA molding process and resulting product is disclosed in which a printed circuit pattern carrier is placed in a mold and is molded to an insulation carrier. The insulation carrier is disclosed as a printed circuit board or the interior of the insulation housing for an electrical product. Plural laminations molded atop one another are disclosed. The printed circuit carrier has mold gate openings to enable molding of features which extend above the plane of the conductive layer. A printed circuit pattern is applied before the molding step. | |
