Patent 4566935 Issued on January 28, 1986. Estimated Expiration Date: July 31, 2004. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
438/29, Including integrally formed optical element (e.g., reflective layer, luminescent material, contoured surface, etc.)216/2, ETCHING OF SEMICONDUCTOR MATERIAL TO PRODUCE AN ARTICLE HAVING A NONELECTRICAL FUNCTION216/24, FORMING OR TREATING OPTICAL ARTICLE216/60, By optical means or of an optical property216/67, Using plasma216/79, Etching silicon containing substrate359/291, Shape or contour of light control surface altered438/619, Air bridge structure445/24Display or gas panel making
Methods of fabrication of spatial light modulators with deflectable beams by plasma etching after dicing of a substrate into chips, each of the chips an SLM, is disclosed. Also, various architectures available with such plasma etching process are disclosed and include metal cloverleafs for substrate addressing, metal flaps formed in a reflecting layer over a photoresist spacer layer, and torsion hinged flaps in a reflecting layer.
IBM Technical Disclosure Bulletin, vol. 24, No. 12, May 1982, Optical Inspection of Hole Bottoms, D. S. Goodman et al., p. 6280