Patent References 2930809 2947771 3425983 3585230 3629308 3649588 Polyolefin composition for electrical insulation Polypheylene ether-resin compositions with organopolyiloxanes having silicon-H-bonds High voltage insulating materials Organosilane compounds InventorsApplicationNo. 06/587007 filed on 03/13/1984US Classes:524/262, Atom other than Si, O, C, or H524/265, Oxygen atom other than as Si-O-Si and at least one Si-C or Si-H group524/581Solid polymer derived from ethyleneExaminersPrimary: Schofer, Joseph L.Assistant: Sarofim, N. Attorney, Agent or FirmInternational ClassesC08K 5/00 (20060101)C08K 5/5435 (20060101) C08L 23/02 (20060101) C08L 23/00 (20060101) AbstractOlefin polymer compositions containing silicone additives which can be extruded through relatively narrow die gaps at commercial extrusion rates to provide film material characterized by improved mechanical and optical properties. The silicone additives have the formula: ##STR1## wherein each R, which can be the same or different, are alkyl radicals, R1 is a monovalent organic radical containing at least one ethyleneoxide group, vicinal epoxy group or amino group and x and y, which can be the same or different, each have a value of at least one. | |