Heat sink mounting
Patent 4521827 Issued on June 4, 1985. Estimated Expiration Date: 
January 12, 2003. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
January 12, 2003. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 1988926 3200296 3492908 3611046 3836825 Assembly of a recessed heat sink and a semiconductor device sealed within the recess in the heat sink and thermally connected to the heat sink Patent #: 4007477 InventorsApplicationNo. 06/457409 filed on 01/12/1983US Classes:361/704, Thermal conduction165/80.1, WITH RETAINER FOR REMOVABLE ARTICLE257/E23.084, With bolts or screws (EPO)29/837, By inserting component lead or terminal into base aperture29/840, By metal fusion361/688With cooling meansExaminersPrimary: Goldberg, Howard N.Assistant: Arbes, Carl J. Attorney, Agent or FirmInternational ClassesH05K 7/20 (20060101)H05K 7/20 (20060101) H05K 3/30 (20060101) H05K 3/30 (20060101) H01L 23/34 (20060101) H01L 23/34 (20060101) H01L 23/40 (20060101) H01L 23/40 (20060101) H05K 1/02 (20060101) H05K 1/02 (20060101) AbstractDisclosed are methods and apparatus for attaching a heat sink mounted semiconductor case to a circuit board employing a stud with a flange near one end. The longer shank is threaded and at least the shorter shank or head stud is tin-plated. The stud may be swaged into a mounting hole in the heat sink and the heat sink and semiconductor case pre-assembled. The pre-assembled unit may then be mounted and soldered to the circuit board along with other circuit components.Other References
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