Centering device for automatic placement of chip components in hybrid circuits
Apparatus for carrying and placing components
Electronic parts mounting apparatus
Apparatus for mounting electronic components
Apparatus for automatically mounting non-lead electronic components on printed-circuit
Component mounting apparatus Patent #: 4473247
ApplicationNo. 06/525392 filed on 08/22/1983
US Classes:29/740, Chip component29/743, Means to apply vacuum directly to position or hold work part29/759, Means to align and advance work part294/2, MISCELLANEOUS COMPOUND IMPLEMENT294/64.1, VACUUM414/744.3And moving vertically
ExaminersPrimary: Cherry, Johnny D.
Attorney, Agent or Firm
International ClassH05K 13/04 (20060101)
Foreign Application Priority Data1983-06-01 JP
AbstractMethod and apparatus for holding an electronic component prior to its placement on a circuit substrate. The component sucked by a sucker is first centered in one direction by closing movements of a first pair of opposed positioning members toward the component, and then centered in another direction normal to the above one direction by closing movements of a second pair of opposed positioning members which occur only after the first pair of positioning members are opened. The first pair of positioning members are provided on an assembly holding the sucker, and the second pair of positioning members are provided on the sucker holder assembly or separately from the sucker holder assembly. In the latter instance, the assembly holding the sucker and the first pair of positioning members are adapted to be movable relative to the separately provided second pair for alignment of the sucker with the separate second pair.
Field of SearchMISCELLANEOUS COMPOUND IMPLEMENT