Lapping machine
Patent 4502252 Issued on March 5, 1985. Estimated Expiration Date: 
March 28, 2003. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
March 28, 2003. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 1465117 3443342 3568371 3668813 3691694 3889428 Methods and apparatus for treating wafer-like articles Patent #: 3970471 InventorAssigneeApplicationNo. 06/479471 filed on 03/28/1983US Classes:451/269, Rotary work holder451/290, Disk or wheel abrader451/339Ejector or unloaderExaminersPrimary: Smith, James G.Assistant: Meislin, D. S. Attorney, Agent or FirmInternational ClassB24B 37/04 (20060101)Foreign Application Priority Data1982-03-29 JPAbstractIn a lapping apparatus, washing water is ejected from washing water holes toward a carrier holding wafers after the wafers are polished. Thus, the wafers are separated from the carrier and upper and lower polishing members. Then, the carrier is forced up above the upper polishing member by a pushing ring. The wafers left on the upper member are carried onto a table by a first sweeper of an automatic collecting device. The transferred wafers are arranged in a line along a second sweeper. Then, the second sweeper pushes and moves the wafers in the direction of their arrangement toward a cassette on one side of the table. The wafers are housed in holder portions in the cassette, and are then immersed, along with the cassette, in a pure water tank.Other References
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