ApplicationNo. 06/419477 filed on 09/17/1982
US Classes:257/785, By pressure alone257/773, Of specified configuration257/E21.505, Insulative mounting semiconductor device on support (EPO)257/E23.026, Bases or plates or solder therefor (EPO)257/E23.078Flexible arrangements, e.g., pressure contacts without soldering (EPO)
ExaminersPrimary: James, Andrew J.
Assistant: Clark, S. V.
Attorney, Agent or Firm
International ClassesH01L 21/02 (20060101)
H01L 21/58 (20060101)
H01L 23/492 (20060101)
H01L 23/48 (20060101)
Foreign Application Priority Data1981-10-23 JP
AbstractA pressure-applied type semiconductor device, in which a metal stamp for urging a semiconductor body is formed with a peripheral annular groove. When pressure is applied, the groove is elastically deformed. Thus, stress concentration in the semiconductor body directly under the edge of the metal stamp can be alleviated.