Thermoelectric device exhibiting decreased stress
Patent 4497973 Issued on February 5, 1985. Estimated Expiration Date: 
February 28, 2003. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
February 28, 2003. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3859143 Glass enclosed solar cell panel Thermocouple split follower High sensitivity variable capacitance transducer Patent #: 4420790 InventorsAssigneeApplicationNo. 06/470154 filed on 02/28/1983US Classes:136/212, Plural hot or cold junctions arranged in a single plane136/205, Electric power generator136/225Having strip, film or plate-type thermocouplesExaminersPrimary: Sebastian, Leland A.Attorney, Agent or FirmInternational ClassesH01L 35/10 (20060101)H01L 35/32 (20060101) H01L 35/00 (20060101) AbstractA thermoelectric device exhibiting both structural integrity and decreased stress across the device notwithstanding the application of thermally cycled temperature differentials thereacross includes, electrically interconnected thermoelectric elements and a rigidly affixed substrate. Thermal stress is relieved by using flexible conductors to interconnect the thermoelectric elements, and by the use of a flexile joint to attach a second substrate to the remainder of the device. Complete elimination of the second substrate may also be used to eliminate stress. Presence of the rigidly affixed substrate gives the device sufficient structural integrity to enable it to withstand rugged conditions. | |
