Hybrid integrated circuit component and printed circuit board mounting said component
Patent 4495546 Issued on January 22, 1985. Estimated Expiration Date: 
May 13, 2002. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
May 13, 2002. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 2693584 3582865 3786439 Method of fabricating a printed wiring board assembly Connector with printed wiring board structure Patent #: 4109298 InventorsAssigneeApplicationNo. 06/377997 filed on 05/13/1982US Classes:361/749, Flexible board257/E23.177, Flexible insulating substrates (EPO)257/E25.029, Devices being of two or more types, e.g., forming hybrid circuits (EPO)29/837, By inserting component lead or terminal into base aperture29/839, Including metal fusion361/784, Plural361/787Having spring memberExaminersPrimary: Kucia, R. R.Attorney, Agent or FirmInternational ClassesH05K 1/18 (20060101)H05K 3/00 (20060101) H05K 1/14 (20060101) H01L 23/538 (20060101) H01L 25/16 (20060101) H01L 23/52 (20060101) H05K 3/36 (20060101) H05K 3/40 (20060101) H05K 3/46 (20060101) Foreign Application Priority Data1981-05-18 JPAbstractA hybrid integrated circuit component for insertion in a slit of a mother printed circuit board, and a method of mounting the hybrid integrated circuit component. The circuit component includes a flexible circuit board composed of a flexible insulated substrate, a circuit conductor formed on one side of the substrate, and a pair of conductor layers formed along opposite sides of the substrate to serve as external connection terminals. Circuit elements are mounted on the substrate and electrically connected to the circuit conductor. A pair of hard supporting plates are cemented on the other surface and at the opposite sides of the substrate so that the flexible circuit board can be folded at a center bending portion of the substrate so that the supporting plates face each other and so that the connection terminals are arranged close to each other when the substrate is folded and so that the substrate at its bending portion, when folded, has a sufficient spring characteristic for ensuring contact between the slit of the mother printed circuit board and each of the connection terminals, when the connection terminals are inserted into the slit of the mother printed circuit board.Other References
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