Anode for magnetic sputtering apparatus
Patent 4478702 Issued on October 23, 1984. Estimated Expiration Date: 
January 17, 2004. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
January 17, 2004. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesPlanar magnetron sputtering device Sputtering process and apparatus Magnetron sputtering devices Magnetically enhanced plasma process and apparatus Patent #: 4422896 InventorsAssigneeApplicationNo. 06/571406 filed on 01/17/1984US Classes:204/298.19, Planar magnetron204/192.12, Glow discharge sputter deposition (e.g., cathode sputtering, etc.)204/298.14Specified anode particularsExaminersPrimary: Demers, Arthur P.Attorney, Agent or FirmInternational ClassesH01J 37/34 (20060101)H01J 37/32 (20060101) AbstractAn improved anode system for producing uniform coatings by magnetic sputtering is disclosed, comprising a pair of anode plates symmetrically designed and positioned along the length of the cathode.Other References
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