Base metal composite electrical contact material
Patent 4475983 Issued on October 9, 1984. Estimated Expiration Date: 
September 3, 2002. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
September 3, 2002. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 2504906 3778257 3841869 3920452 InventorsAssigneeApplicationNo. 06/414595 filed on 09/03/1982US Classes:205/656, Eroding workpiece of nonuniform internal electrical characteristics204/192.32, Sputter etching204/192.35, Etching specified material216/100, Substrate contains elemental metal, alloy thereof, or metal compound216/105, Metal is elemental copper, an alloy, or compound thereof216/13, FORMING OR TREATING ELECTRICAL CONDUCTOR ARTICLE (E.G., CIRCUIT, ETC.)216/75, Substrate contains elemental metal, alloy thereof, or metal compound216/78, Etching of substrate containing elemental copper, or an alloy or compound thereof29/875, By powder metallurgy428/553, Nonparticulate metal component75/228Consolidated metal powder compositionsExaminersPrimary: Powell, William A.Attorney, Agent or FirmInternational ClassesC23F 1/00 (20060101)C25F 3/02 (20060101) C25F 3/00 (20060101) H01H 1/02 (20060101) H01H 1/025 (20060101) AbstractA composite contact material for light-duty electrical contacts is formed by combining, typically by powder-metallurgical techniques, a matrix metal and particles of a conductive material that is typically harder and more corrosion resistant than the matrix metal, and by removing, in a differential material removal step, some of the matrix metal from a surface of the composite, thereby producing a "sandpaper" surface with a substantial number of the particles projecting by a substantial amount above the matrix metal surface. Typical matrix metals are copper, copper alloys, or nickel, and typical particle materials are metals such as Ru, Re, Os, and intermetallics, oxides, borides, nitrides, carbides, silicides, and phosphides of such metals as Al, Ti, Ni, Nb, Mo, Ru, Ta, W, Re, or Os. Particle size is typically between about 0.1 μm and 100 μm, preferably less than 10 μm, and the particle volume fraction is typically between about 1% and 50%, preferably between 5% and 30%. Any appropriate differential material removal method, including chemical, plasma, sputter, thermal, and electrolytic etching, can be used.Other References
|
| ||||||||||||||
