Apparatus for bonding leads to semiconductor chips
Automatic printed circuit dimensioning, routing and inspecting apparatus Patent #: 4295198
ApplicationNo. 06/393653 filed on 06/30/1982
US Classes:348/126, Of electronic circuit chip or board29/832Assembling to base an electrical component, e.g., capacitor, etc.
ExaminersPrimary: Britton, Howard W.
Attorney, Agent or Firm
International ClassesG01N 21/88 (20060101)
G01N 21/956 (20060101)
Foreign Application Priority Data1981-07-06 JP
AbstractImage data of lead terminals and a chip element provided on a circuit board are stored on a video memory. Part of the video data stored in the video memory is read out and stored in a RAM by a microprocessor to be compared with reference pattern data stored in an external memory. The position of the chip element is checked in this way by having reference to the lead terminals.