Method and apparatus for manufacturing thermoelectric devices
Patent 4468854 Issued on September 4, 1984. Estimated Expiration Date: 
April 29, 2002. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
April 29, 2002. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 2980746 3076051 3252205 3409475 3451131 3509620 3580743 3729796 Semiconductor wafer dicing fixture Method of fabricating thermoelectric power generator modules Patent #: 4149025 InventorsAssigneeApplicationNo. 06/373120 filed on 04/29/1982US Classes:438/55, Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor269/21, Vacuum-type holding means29/856, By molding of insulating material438/107Assembly of plural semiconductive substrates each possessing electrical deviceExaminersPrimary: Hearn, Brian E.Assistant: Hey, David A. Attorney, Agent or FirmInternational ClassesH01L 35/00 (20060101)H01L 35/34 (20060101) AbstractAn apparatus for manufacturing thermoelectric devices includes two conductive strip receiving fixtures, a thermoelectric element receiving fixture and a u-shaped member. The conductive strip receiving fixtures act to retain the strips in proper registry during the processing steps of screen printing insulating material, or solder paste thereon as well as during attachment of thermoelectric elements thereto. The element receiving fixture is complemental with either of the strip receiving fixtures to maintain the elements in place during the coupling of the elements to the strips in one of the strip receiving fixtures. The strip receiving fixtures are complemental with the u-shaped member to complete the coupling of the elements to the strips such that the elements are coupled thermally in parallel and electrically in series. The u-shaped member also facilitates the introduction of a ceramic potting compound therebetween.Also disclosed is a method for manufacturing a thermoelectric device. | |
