Apparatus and method of material removal having a fluid filled slot
Patent 4439244 Issued on March 27, 1984. Estimated Expiration Date: 
August 3, 2002. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
August 3, 2002. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesMethod and apparatus for cleaning the surface of a semiconductor slice with a liquid spray of de-ionized water Patent #: 4027686 InventorAssigneeApplicationNo. 06/404798 filed on 08/03/1982US Classes:134/33, Centrifugal force and/or rotated work body134/154, With non-impelling fluid deflector or baffle134/183, Movably mounted, adjustable or removable134/902SEMICONDUCTOR WAFERExaminersPrimary: Bashore, S. LeonAssistant: Woodard, Joye L. Attorney, Agent or FirmInternational ClassG03F 7/30 (20060101)AbstractApparatus and method for cleaning material at the outer edge of an object by applying a fluid, which can be a solvent, for the material to a flat surface adjacent the edge by contact and moving the solvent onto the edge by centrifugal force. A slot is provided in a planar surface. The slot is filled with solvent for contact with the flat surface of the object.Field of SearchCentrifugal force and/or rotated work bodyWith treating fluid motion Including steam, gaseous agent or temperature feature Manufactured articles And spray or jet applying conduit or nozzle Rotary, pivoted or swinging work holder With non-impelling fluid deflector or baffle Rotary, revolving, swinging or oscillating motion work holder or carrier Movably mounted, adjustable or removable | |
