Process and device for unsoldering semiconductor modules in the flip-chip technique Patent #: 4066204
ApplicationNo. 06/331088 filed on 12/15/1981
US Classes:228/264, PROCESS OF DISASSEMBLING BONDED SURFACES, PER SE (E.G., DESOLDERING)228/19WITH MEANS TO REMOVE, COMPACT, OR SHAPE APPLIED FLUX OR FILLER
ExaminersPrimary: Ramsey, Kenneth J.
Attorney, Agent or Firm
International ClassB23K 1/018 (20060101)
AbstractA desoldering tip, adapted to be attached to a standard pencil soldering iron, is formed with a recess adapted to closely fit over a leadless component soldered and adhered with an adhesive to a printed circuit board. Solder present in the recess attaches the component to the tool by molecular attraction. Once the solder and adhesive are melted, the component is readily lifted from the board with the tool. The component is then ejected from the tool.