U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Casing for an electrical component having improved strength and heat transfer characteristics

Patent 4410927 Issued on October 18, 1983. Estimated Expiration Date: Icon_subject June 21, 2002. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

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Inventor

Application

No. 06/390095 filed on 06/21/1982

US Classes:

361/720, For printed circuit board174/16.3, With heat sink257/682, With desiccant, getter, or gas filling257/712, With provision for cooling the housing or its contents257/E23.046, Cross-section geometry (EPO)257/E23.103, Foil-like cooling fins or heat sinks (EPO)257/E23.185, Other leads being parallel to base (EPO)257/E23.193, Characterized by material or arrangement of seals between parts, e.g., between cap and base of container or between leads and walls of container (EPO)361/761, Component within printed circuit board361/767, With mounting pad361/792Plural contiguous boards

Examiners

Primary: Tolin, G. P.

Attorney, Agent or Firm

International Classes

H05K 1/02 (20060101)
H01L 23/34 (20060101)
H01L 23/02 (20060101)
H01L 23/367 (20060101)
H01L 23/495 (20060101)
H01L 23/48 (20060101)
H01L 23/047 (20060101)
H01L 23/10 (20060101)
H05K 1/05 (20060101)
H05K 1/18 (20060101)

Abstract

A casing for an electrical component comprises a metal base member. A metal housing member is mounted on the base member to provide a hollow enclosed casing for receiving the electrical component. A metal lead frame is provided within the enclosed casing and is electrically connected to the electrical component. The lead frame has terminal leads projecting between the base member and the housing member external to the casing. The improvement comprises a device extending from the base member for strengthening the base member and providing additional heat transfer from the casing. Also, an adhesive seals and bonds the terminal leads to both the base member and to the housing member to form the enclosed casing.

Other References

  • IBM Tech. Discl. Bull. vol. 9, No. 11, Apr. 1967, p. 1511, Monolithic Chip Carrier, Betz-Ecker
  • F. Neighbour and B. R. White, "Factors Governing Aluminum Interconnection Corrosion in Plastic Encapsulated Microelectronic Devices", Microelectronics and Reliability, Pergamon Press, Great Britain, vol. 16, 1977, pp. 161-164
  • R. C. Olberg and J. L. Bozarth, "Factors Contributing to the Corrosion of the Aluminum Metal on Semiconductor Devices Packaged in Plastics", Microelectronics and Reliability, Pergamon Press, Great Britain, vol. 15, 1976, pp. 601-611
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