U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Method and apparatus for forming oxide coating by reactive sputtering technique

Patent 4407709 Issued on October 4, 1983. Estimated Expiration Date: Icon_subject March 31, 2002. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

3738926

Apparatus for monitoring vacuum deposition processes
Patent #: 4036167
Issued on: 07/19/1977
Inventor: Lu

Method and apparatus for monitoring etching Patent #: 4289188
Issued on: 09/15/1981
Inventor: Mizutani ,   et al.

Inventors

Assignee

Application

No. 06/363777 filed on 03/31/1982

US Classes:

204/192.13, Measuring or testing (e.g., of operating parameters, property of article, etc.)204/192.14, Coating inorganic material onto polymeric material204/192.15, Specified deposition material or use204/298.03Measuring, analyzing or testing

Examiners

Primary: Demers, Arthur P.

Attorney, Agent or Firm

International Classes

C23C 14/00 (20060101)
G01N 21/62 (20060101)

Foreign Application Priority Data

1981-03-31 JP

Abstract

A method for forming a coating of an oxide on a support by the reactive sputtering technique, which comprises measuring the intensity of at least one spectral component having a given wavelength of the spectrum of a plasma formed between the support and a target composed of an oxidizable substance convertible to said oxide, comparing the measured intensity of the spectral component with the standard intensity of a spectral component of the same wavelength, and continuously or intermittently varying the physical amount of a sputtering gas and/or the amount of an electric current from a sputtering power supply so that the measured intensity of the former spectral component approaches the standard intensity of the latter spectral component; and a sputtering apparatus for performing the aforesaid method, which comprises a vacuum chamber, a target electrode disposed within the vacuum chamber, means for introducing a sputtering gas into the vacuum chamber, means for discharging the sputtering gas from the vacuum chamber, and a power supply for applying a negative voltage, an optical spectroscopic instrument for measuring the intensity of at least one component having a given wavelength of the spectrum of a plasma formed on the surface of the target electrodfe, and control circuit means for comparing the measured intensity of the spectral component with the standard intensity of a spectral component having the same wavelength.

Other References

  • Harshbarger et al., J. Electronic Mat. 7(1978), pp. 429-440
  • Westwood, J. Appl. Phys. 44(1973), p. 2619-2626
  • Westwood et al., J. Appl. Phys. 44(1973), pp. 2610-2618
  • Ratinen, J. Applied Phys. 44(1973), pp. 2730-2734
  • Greene et al., J. Applied Phys. 44(1973), pp. 2509-2513
  • Greene et al., J. Vac. Sci. Technol. 10(1973), pp. 1144-1150
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