Air baffle assembly for electronic circuit mounting frame
Patent 4399485 Issued on August 16, 1983. Estimated Expiration Date: 
December 21, 2001. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
December 21, 2001. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3187082 3236296 Uniformly cooled printed circuit board mounting assembly Patent #: 3967874 InventorsApplicationNo. 06/332480 filed on 12/21/1981US Classes:361/693, Circular165/80.3, Air cooled, including fins174/16.1, By ventilation or gas circulation361/694, With air circulating means361/796With housing or chassisExaminersPrimary: Tolin, G. P.Attorney, Agent or FirmInternational ClassH05K 7/20 (20060101)AbstractA variable width baffle assembly maintains constant, uniform impedance to the flow of cooling air across a vacant space on a partially populated electronic mounting frame for printed circuit board assemblies. The inexpensive but reliable baffle assembly includes end boards mounted on opposite sides of the space and a web member extending therebetween. The web member has a plurality of small apertures distributed thereover with a ratio of aperture area to web member surface area selected to approximate the impedance presented by populated portions of the frame. The web member may be mounted in arched, hinged, corrugated or sliding relationship to accommodate changes in the spacing between end boards so that a single model of baffle assembly can accommodate multiple sizes of vacant spaces. | |
