U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Method of making double level polysilicon series transistor devices

Patent 4380863 Issued on April 26, 1983. Estimated Expiration Date: Icon_subject January 26, 2002. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

Method of making N-channel MOS integrated circuits
Patent #: 4055444
Issued on: 10/25/1977
Inventor: Rao

Integrated circuit device
Patent #: 4084108
Issued on: 04/11/1978
Inventor: Fujimoto

Triple layer polysilicon cell
Patent #: 4099196
Issued on: 07/04/1978
Inventor: Simko

Double level polysilicon series transistor cell
Patent #: 4213139
Issued on: 07/15/1980
Inventor: Rao

Random access memory cell with different capacitor and transistor oxide thickness
Patent #: 4240092
Issued on: 12/16/1980
Inventor: Kuo

Substrate coupled floating gate memory cell
Patent #: 4274012
Issued on: 06/16/1981
Inventor: Simko

High voltage MOSFET with inter-device isolation structure
Patent #: 4290077
Issued on: 09/15/1981
Inventor: Ronen

Double level polysilicon series transistor devices Patent #: 4319263
Issued on: 03/09/1982
Inventor: Rao

Inventor

Assignee

Application

No. 06/342953 filed on 01/26/1982

US Classes:

438/279, Making plural insulated gate field effect transistors having common active region257/366, Overlapping gate electrodes257/E21.209, Making electrode structure comprising conductor-insulator-conuctor-insulator-semiconductor, e.g., gate stack for non-volatile memory (EPO)257/E27.06, Field-effect transistor with insulated gate (EPO)257/E29.264, With multiple gate structure (EPO)438/266, Having additional, nonmemory control electrode or channel portion (e.g., for accessing field effect transistor structure, etc.)438/283Plural gate electrodes (e.g., dual gate, etc.)

Examiners

Primary: Ozaki, G.

Attorney, Agent or Firm

International Classes

H01L 21/02 (20060101)
H01L 29/66 (20060101)
H01L 29/78 (20060101)
H01L 21/28 (20060101)
H01L 27/085 (20060101)
H01L 27/088 (20060101)

Abstract

A plurality of MOS transistors are formed as an integrated semiconductor device, adjacent transistors sharing a common source/drain region which is created by the edges of inverted regions beneath the gates of the transistors. These gates are first and second level polysilicon, with the second partly overlapping the first. On the opposite ends, the source and drain regions are formed by diffusion using the oxide under the first and second level poly as the diffusion mask.

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