Conductive molding composition

Patent 4378310 Issued on March 29, 1983. Estimated Expiration Date:

July 28, 2000. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Abstract Claims Description Full Text

Patent References

3053800

3481893

3842194

3842217

3909517

Disc record and method of compounding disc record composition
Patent #: 3960790
Issued on: 06/01/1976
Inventor: Khanna

Molding composition Patent #: 4151132
Issued on: 04/24/1979
Inventor: Khanna

Inventors

Assignee

RCA Corporation

Application

No. 06/172660 filed on 07/28/1980

US Classes:

252/511, Resin, rubber, or derivative thereof containing252/500, ELECTRICALLY CONDUCTIVE OR EMISSIVE COMPOSITIONS369/126, Electrical modification or sensing of storage medium (e.g., capacitive, resistive, electrostatic charge)369/276, Electrical track structure523/174Phonograph record molding composition or process of preparing

Examiners

Primary: Barr, J. L.

Attorney, Agent or Firm

International Classes

C08L 27/06 (20060101)
C08L 27/00 (20060101)
G11B 9/00 (20060101)
G11B 9/06 (20060101)
C08L 55/00 (20060101)
C08L 55/02 (20060101)
C08L 25/12 (20060101)
C08L 25/00 (20060101)

Abstract

An improved molding composition having a high thermal stability, including a vinyl chloride/vinyl acetate copolymer-based resin, sufficient finely divided conductive particles to obtain the desired conductivity, and from 3 to 20 weight percent of the modifying additive BLENDEX 586, which is a three-component blend of polyvinyl chloride, a graft copolymer of acrylonitrile, styrene and polybutadiene, and a copolymer of alpha-methyl styrene and acrylonitrile, as described in U.S. Pat. No. 3,053,800. High density information discs fabricated from this molding composition have improved dimensional stability and increased resistance to environmental temperature changes.