U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Fluid cooled solar powered photovoltaic cell

Patent 4361717 Issued on November 30, 1982. Estimated Expiration Date: Icon_subject December 5, 2000. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

2963390

3128419

3295089

3609476

3833425

Tandem junction solar cell
Patent #: 4133698
Issued on: 01/09/1979
Inventor: Chiang ,   et al.

Concentrator solar cell array module
Patent #: 4180414
Issued on: 12/25/1979
Inventor: Diamond ,   et al.

Mounting for solar cell
Patent #: 4209347
Issued on: 06/24/1980
Inventor: Klein

Solar cell construction
Patent #: 4249959
Issued on: 02/10/1981
Inventor: Jebens

Method and apparatus for thermo-compression diffusion bonding Patent #: 4252263
Issued on: 02/24/1981
Inventor: Houston

Inventors

Application

No. 06/213259 filed on 12/05/1980

US Classes:

136/246, With concentrator, orientator, reflector, or cooling means136/248, Hybrid conversion system136/255, Schottky, graded doping, plural junction or special junction geometry136/256, Contact, coating, or surface geometry136/259, With concentrator, housing, cooling means, or encapsulated257/714, Liquid coolant257/E31.038, Shape of body (EPO)257/E31.039Shape of potential or surface barrier (EPO)

Examiners

Primary: Weisstuch, Aaron

Attorney, Agent or Firm

International Classes

H01L 31/0248 (20060101)
H01L 31/0352 (20060101)
H01L 31/052 (20060101)

Abstract

Concentrated sunlight impinges on a large area photovoltaic device which is bonded to a highly pliable and thermally and electrically conductive structured copper strain relieving member; the lower face of the structured copper is sealed to a fluid cooled metal heat sink. Large power densities of sunlight are absorbed without appreciable temperature rise. The structured copper accommodates to the difference in expansion between the metal heat sink and the semiconductor wafer. Three embodiments utilize a single planar junction diode, an interdigitated diode, and series connected isolated junction diodes.

PatentsPlus Images
Enhanced PDF formats
loading...
PatentsPlus: add to cart
PatentsPlus: add to cartSearch-enhanced full patent PDF image
$9.95more info
PatentsPlus: add to cart
PatentsPlus: add to cartIntelligent turbocharged patent PDFs with marked up images
$16.95more info
 
Sign InRegister
Username  
Password   
forgot password?