Process for sintering silicon nitride compacts
Patent 4354990 Issued on October 19, 1982. Estimated Expiration Date: 
August 25, 2000. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
August 25, 2000. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.InventorsApplicationNo. 06/180725 filed on 08/25/1980US Classes:264/673, Utilizing particulate or sintered particulate packing, or support501/154Silicon compound containingExaminersPrimary: Parrish, John A.Attorney, Agent or FirmInternational ClassesB22F 3/10 (20060101)C04B 35/593 (20060101) C04B 35/591 (20060101) C04B 35/64 (20060101) C04B 35/584 (20060101) Foreign Application Priority Data1977-12-23 ITAbstractSintered silicon nitride articles are prepared by sintering a silicon nitride compact of a density of at least 1.3 g/cm3 in nitrogen gas atmosphere at substantially atmospheric pressure, while the compact is embedded in a protective powder comprising silicon nitride, boron nitride, or a mixture of silicon nitride and boron nitride, and one or more sinterization additives for silicon nitride, said additives being present in the protective powder in an amount of from 3 to 20% by weight.Field of SearchUtilizing closed mold cavity | |
