ApplicationNo. 06/180725 filed on 08/25/1980
US Classes:264/673, Utilizing particulate or sintered particulate packing, or support501/154Silicon compound containing
ExaminersPrimary: Parrish, John A.
Attorney, Agent or Firm
International ClassesB22F 3/10 (20060101)
C04B 35/593 (20060101)
C04B 35/591 (20060101)
C04B 35/64 (20060101)
C04B 35/584 (20060101)
Foreign Application Priority Data1977-12-23 IT
AbstractSintered silicon nitride articles are prepared by sintering a silicon nitride compact of a density of at least 1.3 g/cm3 in nitrogen gas atmosphere at substantially atmospheric pressure, while the compact is embedded in a protective powder comprising silicon nitride, boron nitride, or a mixture of silicon nitride and boron nitride, and one or more sinterization additives for silicon nitride, said additives being present in the protective powder in an amount of from 3 to 20% by weight.
Field of SearchUtilizing closed mold cavity