Dispersions for activating non-conductors for electroless plating
Patent 4339476 Issued on July 13, 1982. Estimated Expiration Date: 
August 28, 2000. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
August 28, 2000. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3011920 3500927 3532518 3657003 Aqueous suspensions for surface activation of nonconductors for electroless plating Electroless plating process employing non-noble metal hydrous oxide catalyst Method of preparation and use of electroless plating catalysts Dispersions for activating non-conductors for electroless plating Patent #: 4282271 InventorApplicationNo. 06/182124 filed on 08/28/1980US Classes:427/98.1, Activating or catalyst pretreatment106/1.11, Sensitizing composition427/305, Nickel, copper, cobalt, or chromium coating427/306, Organic base427/307, Etching, swelling, or dissolving out part of the base427/99.1Activating or catalyst pretreatmentExaminersPrimary: Kendall, Ralph S.International ClassesH05K 3/38 (20060101)C23C 18/20 (20060101) C23C 18/28 (20060101) H05K 3/18 (20060101) AbstractMetallic surfaces are imparted to non-conductive or dielectric substrates by an electroless (chemical) coating process comprised of coating the surface of the substrate with colloids of catalytic non-precious metals wherein the metals are either part of an alloy or in the elemental state or a compound and wherein the colloidal suspension further comprises antioxidant as to minimize the surface oxidation of the colloids and are further admixed in a manner resulting in good colloidal stability.Other References
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