Copper-to-gold thermal compression gang bonding of interconnect leads to semiconductive devices
Method of making gang bonding interconnect tape for semiconductive devices
Apparatus for and method of shaping interconnect leads
Antioxidant coating of copper parts for thermal compression gang bonding of semiconductive devices Patent #: 4188438
ApplicationNo. 06/140040 filed on 04/14/1980
US Classes:428/572, For severing perpendicular to longitudinal dimension174/536, Lead frame174/538, Wire bonded174/557, Lands257/674, With means for controlling lead tension257/E21.519, Involving application of pressure, e.g., thermo-compression bonding (EPO)257/E23.043, Geometry of lead frame (EPO)29/827, Beam lead frame or beam lead device361/813, Lead frame438/112, And encapsulating438/123Lead frame
ExaminersPrimary: Husar, Francis S.
Assistant: Arbes, Carl J.
Attorney, Agent or Firm
International ClassesH01L 21/02 (20060101)
H01L 23/495 (20060101)
H01L 23/48 (20060101)
H01L 21/603 (20060101)
AbstractA continuous tape is employed in the automatic assembly of semiconductor devices. The tape contains a sequential series of patterns, each one comprising a plurality of metal fingers. Each pattern includes fingers having an inward extension that terminates in a configuration that mates with the contact pattern of the semiconductor device. Desirably these fingers are thermocompression gang bonded to the semiconductor contact pads. This attaches the semiconductor device to the tape for further processing. In one assembly method the fingers have an outward extending portion that is designed for bonding to a secondary structure such as a lead frame destined to become part of the final housing. The fingers in the pattern are joined together by means of a ring located at or near the point at which they are bonded to the lead frame. After the lead frame bonds are achieved, preferably by thermocompression gang bonding, the ring is severed at locations between the fingers. If desired, the ring structure can be weakened at those points where it is to be severed.