Apparatus for generating layers on a carrier foil

Patent 4301765 Issued on November 24, 1981. Estimated Expiration Date:

August 27, 2000. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Abstract Claims Description Full Text

Patent References

2925062

3069283

3183563

3600122

3669720

Dielectric formed by a thin-layer polymer, a process for producing said layer and electrical capacitors comprising this dielectric
Patent #: 4153925
Issued on: 05/08/1979
Inventor: Gazard , et al.

Apparatus for fabrication of magnetic recording media Patent #: 4220117
Issued on: 09/02/1980
Inventor: Shinohara

Inventors

Application

No. 06/181691 filed on 08/27/1980

US Classes:

118/718, Running length work118/50.1, With means to apply electrical and/or radiant energy to work and/or coating material118/719, Multizone chamber118/721, Substrate contacting mask118/723E, Having glow discharge electrodes (e.g., DC, AC, RF, etc.)118/723VE, Vacuum evaporation means within deposition chamber (e.g., activated reactive evaporation, etc.)118/730Rotary

Examiners

Primary: Smith, John D.
Assistant: Plantz, Bernard F.

Attorney, Agent or Firm

Hill, Van Santen, Steadman, Chiara & Simpson

International Classes

C23C 14/56 (20060101)
H01G 4/14 (20060101)

Foreign Application Priority Data

1979-12-28 DE

Abstract

Apparatus for generating layers on a carrier film wherein a plurality of glow polymerization layers and intervening metal layers are applied to a carrier foil 3 on a continuous process. The carrier foil is passed over a drum 4 and conducted through a first vacuum system wherein glow polymerization electrodes apply glow polymerization layers to the foil then the foil passes through a vacuum lock into a second vacuum chamber wherein a metallization device 10 is situated so as to apply a metallization layer. Then the foil passes through a second vacuum lock to the first vacuum chamber wherein a second polymerization layer is applied over the metallization layer. A diaphragm strip 19 also passes over the foil and is continuously used during the polymerization and metallization steps.