Patent References 3888708 3912563 Method for machining surfaces of semiconductor substrates Patent #: 4108715 InventorAssigneeApplicationNo. 06/124781 filed on 02/26/1980US Classes:438/53, Having diaphragm element257/E29.324, Controllable by variation of applied mechanical force (e.g., of pressure) (EPO)438/749, Sequential application of etchant438/928FRONT AND REAR SURFACE PROCESSINGExaminersPrimary: Powell, William A.Attorney, Agent or FirmInternational ClassesG01L 9/00 (20060101)H01L 29/66 (20060101) H01L 29/84 (20060101) Foreign Application Priority Data1978-05-30 GBAbstractA silicon transducer including a silicon frame with one or more lands extending from a diaphragm or the like. The lands are interconnected by two thin strips formed integrally with the lands. The strips are essentially the transducer. The transducer is constructed by etching a boron doped wafer with a mixture of catechol, ethylene diamine and water.Other References
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