U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Method of making transducer

Patent 4293373 Issued on October 6, 1981. Estimated Expiration Date: Icon_subject February 26, 2000. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

3888708

3912563

Method for machining surfaces of semiconductor substrates Patent #: 4108715
Issued on: 08/22/1978
Inventor: Ishikawa ,   et al.

Inventor

Assignee

Application

No. 06/124781 filed on 02/26/1980

US Classes:

438/53, Having diaphragm element257/E29.324, Controllable by variation of applied mechanical force (e.g., of pressure) (EPO)438/749, Sequential application of etchant438/928FRONT AND REAR SURFACE PROCESSING

Examiners

Primary: Powell, William A.

Attorney, Agent or Firm

International Classes

G01L 9/00 (20060101)
H01L 29/66 (20060101)
H01L 29/84 (20060101)

Foreign Application Priority Data

1978-05-30 GB

Abstract

A silicon transducer including a silicon frame with one or more lands extending from a diaphragm or the like. The lands are interconnected by two thin strips formed integrally with the lands. The strips are essentially the transducer. The transducer is constructed by etching a boron doped wafer with a mixture of catechol, ethylene diamine and water.

Other References

  • INSPEC: IEEE Transactions on Electron Devices, vol. Ed-23, No. 6, pp. 579-583, Jun. 1976, Schottky Diodes and Other Devices on Thin Silicon Membranes by C. L. Huang et al
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