Method for machining surfaces of semiconductor substrates Patent #: 4108715
ApplicationNo. 06/124781 filed on 02/26/1980
US Classes:438/53, Having diaphragm element257/E29.324, Controllable by variation of applied mechanical force (e.g., of pressure) (EPO)438/749, Sequential application of etchant438/928FRONT AND REAR SURFACE PROCESSING
ExaminersPrimary: Powell, William A.
Attorney, Agent or Firm
International ClassesG01L 9/00 (20060101)
H01L 29/66 (20060101)
H01L 29/84 (20060101)
Foreign Application Priority Data1978-05-30 GB
AbstractA silicon transducer including a silicon frame with one or more lands extending from a diaphragm or the like. The lands are interconnected by two thin strips formed integrally with the lands. The strips are essentially the transducer. The transducer is constructed by etching a boron doped wafer with a mixture of catechol, ethylene diamine and water.