U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Bonding apparatus for thermoplastic coated materials

Patent 4285758 Issued on August 25, 1981. Estimated Expiration Date: Icon_subject March 26, 2000. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

3148104

3660206

3769125

3875368

Method and device for the tape-sealing of panels of paper, cardboard, plastic, or wood, and adhesive tape therefor Patent #: 4181558
Issued on: 01/01/1980
Inventor: Neubronner

Inventors

Assignee

Application

No. 06/134098 filed on 03/26/1980

US Classes:

156/498, With work cooling means156/499, With separate (nonpress) heating means for work156/574, Work traversing type and/or means applying work to wall or static structure156/575, With liquid applying means156/576, Grip or clamp for web end156/578With liquid adhesive or adhesive activator applying means

Examiners

Primary: Weston, Caleb

Attorney, Agent or Firm

International Classes

B31B 1/90 (20060101)
B31B 1/74 (20060101)
B29C 65/10 (20060101)
B29C 65/12 (20060101)
B29C 65/00 (20060101)
B29C 65/18 (20060101)
B29C 65/50 (20060101)
B29C 65/20 (20060101)
B05C 9/14 (20060101)
B29C 35/16 (20060101)
B29C 35/00 (20060101)

Abstract

A bonding apparatus for applying a thermoplastic-adhesive coated core material to a moving substrate as disclosed. Heat exchanger guide means directs a continuous length of hot melt strand to an output orifice at a bonding station. The hot melt adhesive is softened by the unique heat exchanger means to its flow point, just before the strand leaves the output orifice. A rapidly replaceable bonding shoe presses the hot melt strand onto a substrate moving past the bonding station, as soon as the heated strand leaves the output orifice, thus bonding the strand to the moving substrate. Biasing means selectively provides presettable compression or tension forces to the bonding shoe, as required by the particular bonding application. Optional cooling apparatus positioned immediately downstream from the bonding station, further compresses the hot melt strand on the substrate and cools the adhesive to bonding consistency.

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