Packaging of pressure sensor cells Patent #: 4128006
ApplicationNo. 06/072503 filed on 09/04/1979
US Classes:361/283.1, Pressure361/773, Shaped lead on components73/724Capacitive
ExaminersPrimary: Goldberg, E. A.
Attorney, Agent or Firm
International ClassG01L 9/00 (20060101)
AbstractA capacitive pressure transducer assembly having a semiconductor transducer device, a substrate, and a cover for use in conducting a fluid pressure to be sensed to the exterior surfaces of the transducer device. The transducer device may have a glass, silicon or other nonconductive material as a base on which a metal capacitor plate is formed. The other capacitor plate may be formed of doped silicon or other semiconductor material. Also, the substrate on which the transducer device is mounted may have additional and related circuitry implemented in thick film technology (ceramic substrate) or integrated circuit technology (semiconductor substrate).