Soldering to a gold member

Patent 4268585 Issued on May 19, 1981. Estimated Expiration Date:

June 1, 1998. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Abstract Claims Description Full Text

Patent References

2220961

3160798

3205297

3207838

3209450

3472653

3583063

3645785

3660632

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Inventors

Assignee

Licentia Patent-Verwaltungs-GmbH

Application

No. 05/911307 filed on 06/01/1978

US Classes:

428/622, More than one such component174/257, Conducting (e.g., ink)174/259, Adhesive/bonding174/261, With particular conductive connection (e.g., crossover)228/180.1, Simultaneous bonding of multiple joints (e.g., dip soldering of printed circuit boards)228/262.61, Brazing or soldering427/125, Silver, gold, platinum, or palladium427/374.4, Fused or molten coating cooled427/376.8, Metal base427/404, Metal coating427/97.4, With posttreatment of coating or coating material428/209, Including metal layer428/621, With additional, spatially distinct nonmetal component428/624, Organic component428/647, Next to Group IB metal-base component428/672, Au-base component428/901PRINTED CIRCUIT

Examiners

Primary: Smith, John D.

Attorney, Agent or Firm

Spencer & Kaye

International Classes

B23K 1/19 (20060101)
B23K 35/00 (20060101)
H01R 43/02 (20060101)
H05K 3/34 (20060101)

Foreign Application Priority Data

1977-06-01 DE

Abstract

A method of applying solder to gold by applying a gold-tin intermediate layer to the gold and applying the solder over at least a portion of the intermediate layer. The method can be employed to produce a printed circuit unit composed of a printed circuit board, at least one gold member mounted on the board, a gold-tin intermediate layer bonded to at least a portion of the gold member, and solder bonded onto the intermediate layer.