Patent References 3819461 Ply of parallel filaments Method for bonding composite materials Fabric with boron filaments Patent #: 3997697 InventorApplicationNo. 05/904709 filed on 05/10/1978US Classes:156/166, Bonding of flexible filamentary material while in indefinite length or running length156/176, To web of indefinite length228/190, Of concurrently bonded stacked laminae428/114, Including grain, strips, or filamentary elements in different layers or components parallel428/161, With component conforming to contour of nonplanar surface428/162, And conforming component on an opposite nonplanar surface428/164, Containing metal or metal compound428/166, Interlaminar spaces428/593, Honeycomb, or with grain orientation or elongated elements in defined angular relationship in respective components (e.g., parallel, inter- secting, etc.)428/902, HIGH MODULUS FILAMENT OR FIBER442/378Preformed metallic film or foil or sheet (film or foil or sheet had structural integrity prior to association with the nonwoven fabric)ExaminersPrimary: McCamish, Marion E.Attorney, Agent or FirmInternational ClassesB23K 20/233 (20060101)B23K 20/22 (20060101) C22C 47/20 (20060101) C22C 47/00 (20060101) AbstractA monolayer tape for use in making up a multilayer matrix or composite which is bonded at a high pressure and temperature by pressing the composite between heated platens in air to cause densification, the tape consisting of collimated fibers held together by metal wire woven with and at right angles to the fibers, the wire being the same material as the matrix to become a part thereof when the composite is bonded. The aluminum matrix in which the fibers are embedded is provided by aluminum foils alternating with the collimated fibers in the multilayer matrix.Field of SearchFibersHoneycomb, or with grain orientation or elongated elements in defined angular relationship in respective components (e.g., parallel, inter- secting, etc.) Foil or filament smaller than 6 mils Composite Embodying fibers interengaged or between layers (e.g., paper, etc.) Laterally noncoextensive components (e.g., embedded, etc.) Solid state alloying (e.g., diffusion, to disappearance of an original layer) With component conforming to contour of nonplanar surface And conforming component on an opposite nonplanar surface Containing metal or metal compound Interlaminar spaces HIGH MODULUS FILAMENT OR FIBER | |